Technical parameter
Applicable medium
Single component silicone, SMT glue, UV glue, hot melt glue, silicone, bottom filling glue, epoxy resin, red glue, Taffy glue, AB glue and other high viscosity adhesives
Minimum jet disk
0.3nl (depends on media)
Maximum injection velocity
500-100 times/second
Applicable viscosity
Medium to low high viscosity, Max 2,000,000Cps
Firing pin and nozzle type
Replaceable, depending on material and shape
controller
L:260mm W:265mm H :93mm
Feed pressure
0-8Bar Max 800Bar
Operation mode
Pulse mode, single point mode, unlimited mode
Heating module
It can be heated to 150 degrees Celsius
Communication port
I/O Output DC ovV/24V
Input voltage
AC 220v-250v